BTREND BT-924 SOLDER PASTE 220°C
High-performance solder paste designed for BGA (Ball Grid Array) chips and electronic soldering on motherboards, especially suited for chipsets that require higher temperatures. With a melting point of 220°C, this paste ensures strong, durable connections for components that demand a higher thermal threshold. Ideal for professional and demanding applications, it provides excellent bonding strength and reliable performance for BGA reballing and other high-temperature soldering needs in multilayer PCB and chipset repairs.
